Company profile
EGIDE
EGIDE designs and manufactures hermetic packages for electronic and photonic chips. Its ceramic-to-metal, glass-to-metal and HTCC packaging products protec...
Facts
- Segment
- DEFENSE
- Country
- FR
- Headquarters
- Paris, Île-de-France
- Founded
- 2025
- Website
- https://www.egide-tech.com/
About EGIDE
EGIDE’s packages create a sealed mechanical and electrical interface around sensitive chips, sensors and optical components. The company joins ceramics, metals and glass while managing feedthroughs, thermal expansion and heat removal, protecting devices from moisture, contamination and pressure changes in demanding environments.
Its HTCC operation is vertically integrated from ceramic powders and conductive inks through multilayer fabrication, metallisation, brazing, plating and hermetic testing. EGIDE works with customers on package geometry and material selection before manufacturing in France and the United States, making custom engineering and qualification part of the delivery model.
Market context
DEPLOYMENT
Summary
Type: C-UAS startup
Core: Interceptors
Function: Interception
Audience: Defense