HyperLight closes USD 80 million Series C
HyperLight closed an USD 80 million Series C led by MediaTek to scale its TFLN Chiplet platform for AI optical infrastructure.
Evidence notes
- UMC Capital, Jabil, Foxconn, EDBI, CDIB-TEN Capital and Qatar Investment Authority participated alongside existing investors.
- HyperLight planned to expand manufacturing capacity, customer qualification and partnerships across foundry, networking and systems integration.
- The round followed work to move the TFLN platform toward high-volume production on both six-inch and eight-inch wafers.
Company context
HyperLight develops production-grade thin-film lithium-niobate photonic integrated circuits and optical chiplets.