Winbond introduces CUBE memory architecture for edge AI devices
Winbond introduced its Customized Ultra-Bandwidth Elements architecture, a compact and power-efficient memory technology for edge AI, ADAS, surveillance and collaborative robots.
Evidence notes
- CUBE supports memory densities from 256 Mb to 8 Gb per die and can be 3D stacked to increase bandwidth.
- Specified performance spans 32 to 256 GB/s per die with power consumption below 1 pJ per bit.
- Target applications include edge devices, ADAS, surveillance equipment and collaborative robots.
Company context
Winbond supplies specialty memory products including DRAM, mobile DRAM, code-storage flash and low-power memory solutions.