T-Robotics introduces high-temperature double-parallel-link vacuum robot arm
T-Robotics introduced a double-parallel-link vacuum robot arm designed to move glass substrates and AI-semiconductor process material in high-vacuum environments.
Evidence notes
- The double-parallel-link arm supports payloads up to 240 kilograms and operating temperatures up to 500 degrees Celsius.
- It is designed to transfer glass substrates and AI-semiconductor process material in high-vacuum environments.
- T-Robotics is developing related mass-production equipment around the high-temperature vacuum-handling architecture.
Company context
T-Robotics develops vacuum-transfer robots, AGV/AMR systems and rehabilitation or wearable robots for semiconductor, display and industrial automation customers.