Goertek Microelectronics and Infineon collaborate on industrial 3D ToF cameras
Goertek Microelectronics signed a cooperation memorandum with Infineon to develop 3D time-of-flight camera products for industrial automation.
Evidence notes
- The collaboration combines Goertek Microelectronics’ camera-module and sensing integration with Infineon’s time-of-flight technology.
- Target applications include robotic depalletizing, pallet recognition and perception for unmanned forklifts and AMRs.
- The planned camera products address industrial depth sensing rather than the company’s separate consumer-electronics portfolio.
Company context
Goertek Microelectronics develops MEMS sensors, pressure sensors, sensing modules and system-in-package products. Its SPA06-series barometers are integrated into current drone flight-control hardware.