XFEON develops physical-AI infrastructure spanning AI chips, embodied-intelligence data flywheels and embodied-intelligence brain systems. The Chengdu company raised more than RMB 300M in July 2026 for next-generation chips, physical-AI infrastructure and market expansion.
XFEON develops physical-AI infrastructure spanning AI chips, embodied-intelligence data flywheels and embodied-intelligence brain systems. The Chengdu company raised more than RMB 300M in July 2026 for next-generation chips, physical-AI infrastructure and market expansion.