Dragonwing RB3 Gen 2 Core Kit

Qualcomm Dragonwing RB3 Gen 2 Core Kit is an embedded robotics development platform built around the QCS6490 processor, with edge AI, camera, display, connectivity and expansion interfaces.

Facts

  • Company: Qualcomm
  • Type: Edge AI Kit
  • Positioning: RB3 Gen 2
  • Function: Vision compute
  • Audience: Developers
  • Status: Commercial
  • Website: https://www.qualcomm.com/developer/hardware/rb3-gen-2-development-kit

Specifications

  • Camera Expansion: Two C-PHY/D-PHY 30-pin camera expansion ports on the interposer board
  • Kit Contents: Development board, 12 V supply, USB-C cable, mini speakers, setup guide and switch pick tool
  • Onboard Imu: ICM-42688 onboard inertial measurement unit
  • Board Standard: 96Boards-compatible modular hardware design
  • Operating Systems: Supports Qualcomm Linux, Android, Ubuntu and Windows
  • Audio: One digital microphone and two digital audio amplifiers; I2S, SoundWire and DMIC expansion
  • AI compute: Up to 12 dense TOPS on the RB3 Gen 2 platform
  • Processor: Qualcomm QCS6490 processor

Market context

Developers

  • Peer Group: Robot Compute, Edge Ai Computers
  • Workflow: Robotics development kit
  • Capability: Edge AI inference

View market context