VACTRA-Pinnacle Context

Audience

Semiconductor equipment makers and fabs

Workflow

Transfer multiple wafers within semiconductor process equipment

Specifications

• Axes: 8 axes
• Body Size: Ø372 × 530 mm body
• Reach Mm: R-axis stroke up to 680 mm centre-to-centre
• Vertical Lift Mm: 90 mm Z-axis stroke

Tags

• Peer Group: Semiconductor Wafer-Transfer Robot