STMicroelectronics expands into 3D depth sensing with latest time-of-flight sensors
STMicroelectronics expands into 3D depth sensing with latest time-of-flight sensors
Evidence notes
- ST launched new 3D indirect time-of-flight depth sensors
- ST explicitly highlighted robot navigation and collision avoidance as target use cases
- The release strengthens ST's robotics relevance in perception and ranging hardware
Company context
Semiconductor and embedded solutions vendor spanning MCUs, power, analog, and motor-control ICs.