Silicon Box secures SGD 100 million debt financing
Silicon Box secured SGD 100 million in debt financing from funds managed by Ares, InnoVen Capital, January Capital and Abound Capital.
Evidence notes
- The financing was structured as debt rather than an equity funding round.
- Silicon Box said the capital would support growth in advanced panel-level packaging and chiplet integration.
- The facility included an option that could increase the financing to USD 75 million equivalent under the disclosed terms.
Company context
Silicon Box provides high-volume panel-level semiconductor packaging and chiplet integration services.