Winbond Timeline

Events

• 2023-09-27 - Product Launch - Winbond introduces CUBE memory architecture for edge AI devices - CUBE supports memory densities from 256 Mb to 8 Gb per die and can be 3D stacked to increase bandwidth. Specified performance spans 32 to 256 GB/s per die with power consumption below 1 pJ per bit. Target applications include edge devices, ADAS, surveillance… - source: winbond.com