Raon Robotics says U.S., Japanese and Chinese semiconductor equipment customer entry is becoming visible

Evidence notes

• The target systems combine DD-motor robots, EFEM wafer-transfer modules and vacuum-transfer modules into semiconductor backbone equipment.
• Raon said one U.S. equipment maker is discussing next-generation product supply, two Japanese equipment makers are in quality-test or production-supply stages, and a Chinese equipment maker is validating new DD-motor robots.
• The company said DD-motor robots can cut vibration by up to 50%, while DD integration can improve wafer throughput by 20%.