Jetson AGX Orin Industrial Context

Audience

Compute OEMs

Workflow

edge_inference

Specifications

• Memory Bandwidth Gbps: 204.8 GB/s memory bandwidth
• Shock Vibration: Operational 50G/11 ms shock and 5G vibration rating
• Humidity Endurance: 85°C / 85% RH for 1,000 hours powered on
• Memory Gb: 64 GB 256-bit LPDDR5 with inline ECC
• Cpu: 12-core Arm Cortex-A78AE v8.2 64-bit CPU
• Gpu: 2048-core NVIDIA Ampere GPU with 64 Tensor Cores
• Dimensions Mm: 100 × 87 mm system-on-module
• Storage: 64 GB eMMC 5.1
• Operating Temperature C: -40°C to 85°C at TTP
• Operating Lifetime Years: 10-year operating lifetime; 87,000 hours at 85°C
• AI compute: Up to 248 TOPS AI performance
• Power Rating: Configurable 15–75 W power range
• Ruggedization: Extended temperature, shock and vibration capability for ruggedized systems

Tags

• Peer Group: Robot Compute, Edge Ai Computers
• Capability: Edge AI inference
• Stack Layer: Compute Control Layer

Comparable Systems

• MIC-711-OX Edge AI System - Advantech - Component
• ROScube-X2 - ADLINK Technology - Component
• RDK X5 - D-Robotics - Component
• Dragonwing RB3 Gen 2 Vision Kit - Qualcomm - Component
• Dragonwing RB3 Gen 2 Core Kit - Qualcomm - Component
• Kria KR260 Robotics Starter Kit - Advanced Micro Devices - Component
• NVIDIA Jetson AGX Orin Developer Kit - NVIDIA - Component
• Hailo-10H - Hailo - Component
• CV72S AI Vision SoC - Ambarella - Component
• Cube Orange+ Flight Controller - CubePilot - Component
• DEEPX DX-V3 Series - DEEPX - Component
• VOXL 2 - ModalAI - Component