Compact dual visible and thermal camera-module family for uncrewed systems, robotic platforms and embedded AI perception.
Target environment: UAS, UGVs, robotic platforms and compact autonomous-system payloads
Workflow context: Visible and thermal imaging, radiometric sensing, all-light data collection and optional AI detection and tracking
Customer context: Platform integrators combining thermal and high-resolution visible sensing in a single SWaP-constrained payload.
Deployment model: In-production OEM camera family with shared interfaces, development kits, drivers and integration guides.
Commercial maturity: Commercial in-production family with radiometric and non-radiometric models and published integration resources.
Adoption constraints: Integration depends on model and lens selection, processor and driver support, video interface, calibration, environmental protection, export classification and payload SWaP.
Adjacent products: Teledyne FLIR Boson+, Hadron development kits and other dual EO/IR OEM camera modules
Audience
UAV makers
Workflow
Visible and thermal imaging, radiometric sensing, all-light data collection and optional AI detection and tracking
Deployment environment
UAS, UGVs, robotic platforms and compact autonomous-system payloads
Specifications
Visible Camera Resolution: 64 MP visible camera
Thermal Resolution: 640 x 512 Boson or Boson+ thermal camera
Video Output: Flexible dual 60 Hz video output via USB or MIPI
Thermal Sensitivity: <=40 mK or <=20 mK depending on model
Dimensions: 35 x 49 x 45 mm without lens
Power Consumption: Typical <1.8 W; max <2.9 W
Compliance: NDAA compliant and ITAR free
Ip Rating: IP54 with rear interfaces sealed
Weight: 56 g
Tags
Peer Group: Thermal Visible Camera, Dual Visible Thermal Camera Modules