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Hyfix raises $15 million seed round to develop U.S.-made autonomous systems chip for drones and robots

Date: 2026-04-15 · Type: funding · Company: HYFIX

Hyfix Spatial Intelligence raised a $15 million seed round to develop an integrated system-on-chip combining flight control, positioning, communications, and onboard compute for drones and autonomous systems.

  • Hyfix Spatial Intelligence raised a $15 million seed round to develop an integrated system-on-chip combining flight control, positioning, communications, and onboard compute for drones and autonomous systems.
  • The company is positioning the chip as a domestic alternative to fragmented and foreign-dependent drone hardware stacks, with a focus on U.S.-manufactured silicon.
  • The platform integrates high-precision positioning via GEODNET's RTK network and is designed to operate in GPS-denied or spoofed environments.
  • Hyfix said it plans to deliver production-ready chips to initial partners and is building a reference drone platform to demonstrate the system.

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